Honeycomb Cardboard Voidformer Solutions
Developed to create space between the soil and building foundation, Clayform reduces the upward force transmitted to the structure due to ground heave. Clayform has the ability to support the load of concrete when it is poured and due to its degradability will break down over time leaving a genuine void. This reduces the risk of reactive soils impacting upon the slab or causing damage to the structure in the future
Honeycomb Cardboard Voidformer Solutions
Developed to create space between the soil and building foundation, Clayform reduces the upward force transmitted to the structure due to ground heave. Clayform has the ability to support the load of concrete when it is poured and due to its degradability will break down over time leaving a genuine void. This reduces the risk of reactive soils impacting upon the slab or causing damage to the structure in the future
Honeycomb Cardboard Voidformer Solutions
This is the future of production. Whether it's display printing, packaging, display, dunnage, freight or construction we have a cost effective customisable option yet surprisingly strong, lightweight and environmentally friendly.
Why Voidformer?
Reactive soils occur extensively across Australia.
These soils typically contain a higher proportion of clay and can expand or contract when impacted by moisture. This is one of the predominant reasons why it is important to do a thorough geo technical analysis of the site prior to beginning construction. The potential damage caused to a building by ground movement can be costly and the impact is often not seen for many years into the future.
THE SOLUTION
Lite Group Clayform is the premier voidforming solution for engineers and builders across Australia.
Developed to create space between the soil and building foundation, Clayform reduces the upward force transmitted to the structure due to ground heave. Clayform has the ability to support the load of concrete when it is poured and due to its degradability will break down over time leaving a genuine void. This reduces the risk of reactive soils impacting upon the slab or causing damage to the structure in the future.
TESTING RESULTS
Compression Load Testing of Clayform Void Forming Panels
Commissioned by Lite Group Pty Ltd to be conducted by:
Melbourne Testing Services
Report No. MT-19/0276
Date of Report: 28th of March, 2019
PROJECTS
THE CLAYFORM SPECIFICATION Guide
download the latest PDF version
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